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Packging cleaning

Chip level packaging is soldered at nm level intervals, and the active agent and other hygroscopic substances left behind by the soldering flux. If there is a small amount of hygroscopic active agent in the smaller layer spacing, it can occupy a relatively large chip space, affecting chip reliability. To remove residues from a limited space, cleaning agents need to have low surface tension to penetrate into the interlayer chips, achieving the goal of removing residues.

system-in-package

System-in-package cleaning: POP stacked chips/ System-in-package are welded at a mm level spacing, leaving behind hygroscopic substances such as active agents after the application of soldering flux. If there is a small amount of hygroscopic active agent in the smaller layer spacing, it can occupy a···

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PoP stack chip

(2D/2.5D/3D integration) PoP stack chip cleaning: PoP stack chips are welded at a mm level spacing, and the active agent and other hygroscopic substances left behind by the soldering flux. If there is a small amount of hygroscopic active agent in the smaller layer spacing, it can occupy a relatively···

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Flip chip

Flip chip cleaning: After reflow soldering the flip chip onto the substrate, the bare chip needs to be filled with filler material. Therefore, any residual solder will cause interface defects such as layering, voids, and stripes in the filling effect. So the residual flux in the narrow space between···

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Wafer level packaging

There are various pollutants on the substrate pad of advanced packaging product chips before and after soldering, which can be classified into two categories: ionic and non ionic. Ionic pollutants come into contact with moisture in the environment and undergo electrochemical migration after being el···

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Packging cleaning

Packging cleaning

system-in-package

PoP stack chip

Flip chip

Wafer level packaging