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COB Bonding cleaning

COB Bonding Cleaning: COB Bonding is the process of bonding chips onto clean PCB boards with glue, conducting performance tests, and then sealing, curing, packaging, and warehousing. The above process requires a clean interface in both bonding and sealing to ensure the reliability of the product. The cleaning agent developed by Unibright, combined with appropriate cleaning processes, can provide clean interface conditions for COB Bonding.

Unibright provides you with professional COB Bonding water-based cleaning process solutions.

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Unibright COB Bonding cleaning advantages

1. The pH value is neutral, demonstrating excellent material compatibility with sensitive materials such as aluminum, copper, nickel, plastic, and labels.

2. Diluted with deionized water in a certain proportion, it is not easy to foam and can be used in spray and ultrasonic processes.

3. Halogen free, environmentally friendly materials; The odor is light, the liquid used has no flash point, and it is safe to use without the need for additional explosion-proof measures.

4. Due to its neutral pH, it reduces the difficulty of sewage treatment.

COB Bonding cleaning recommended products

W3000 W3000D-1 W3100 W3210

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COB Bonding cleaning application

Used to remove flux, solder paste, and solder paste residues from PCBA, packaging devices, and power electronics. This product can effectively remove solder paste, solder paste, and flux residues on various semiconductor electronic devices. For flip chip, semiconductor sealing water-based environmental cleaning, PoP stacked chips, SIP system packaging, semiconductor chips, semiconductor power devices, power modules (photoelectric modules, sensing modules, communication modules), power electronics, IGBT power modules, DCB power cleaning, lead frame, BGA ball planting cleaning, discrete devices Electronic components and other components have excellent cleaning effects.

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